Block Diagram

Board Specifications


  • Xilinx Kintex UltraScale+
    • KU3P in an B784 package
    • Core speed grade – 2
  • Contact BittWare for additional FPGA option

On-board DDR4 SDRAM

  • Two banks of DDR4 SDRAM x 32 bits
  • 8GB bank (16GB version also available)
  • Transfer Rate: up to 2400 MT/s

Host interface

  • M.2 interface supporting Gen3 x4 PCIe


  • Passive heatsink


  • Hot swapping tolerant
  • Power dissipation is application dependent
  • TDP: 14.85W max
  • Module Absolute Peak Power (20us): 24W


  • Operating temperature: 5°C to 50°C at module inlet
  • Cooling: air convection


  • Manufactured to ISO9001:2008 IPC JSTD-001 -Class III
  • RoHS compliant

Form factor

    • M.2 Accelerator Module Hardware Specification* (not designed for standard M.2)

Draft specification document:

Development Tools

FPGA development

  • BIST – Built-In Self-Test for CentOS 7 provided with source code (pinout, gateware, PCIe driver and host test application)

Application development

  • Xilinx Tools – Vivado Design Suite HLx Editions: HDL and C/C++ with HLS

PCIe carrier card

  • PCIe carrier card allowing 250-M2D to be populated in a standard PCIe slot for lab development


  • 250-M2D FPGA board
  • Built-In Self-Test (BIST)
  • Eideticom NoLoad pre-installed (optional)
  • SEAL pre-installed (optional)
  • 1-year access to online Developer Site
  • 1-year hardware warranty
  • Contact BittWare for extended warranty and support options