Block Diagram
Board Specifications
FPGA
- Xilinx Kintex UltraScale+
- KU3P in an B784 package
- Core speed grade – 2
- Contact BittWare for additional FPGA option
On-board DDR4 SDRAM
- Two banks of DDR4 SDRAM x 32 bits
- 8GB bank (16GB version also available)
- Transfer Rate: up to 2400 MT/s
Host interface
- M.2 interface supporting Gen3 x4 PCIe
Cooling
Electrical
- Hot swapping tolerant
- Power dissipation is application dependent
- TDP: 14.85W max
- Module Absolute Peak Power (20us): 24W
Environmental
- Operating temperature: 5°C to 50°C at module inlet
- Cooling: air convection
Quality
- Manufactured to ISO9001:2008 IPC JSTD-001 -Class III
- RoHS compliant
Form factor
-
- M.2 Accelerator Module Hardware Specification* (not designed for standard M.2)
Draft specification document: https://www.opencompute.org/wiki/Server/Working
Development Tools
FPGA development
- BIST – Built-In Self-Test for CentOS 7 provided with source code (pinout, gateware, PCIe driver and host test application)
Application development
- Xilinx Tools – Vivado Design Suite HLx Editions: HDL and C/C++ with HLS
PCIe carrier card
- PCIe carrier card allowing 250-M2D to be populated in a standard PCIe slot for lab development
Deliverables
- 250-M2D FPGA board
- Built-In Self-Test (BIST)
- Eideticom NoLoad pre-installed (optional)
- Myrtle.ai SEAL pre-installed (optional)
- 1-year access to online Developer Site
- 1-year hardware warranty
- Contact BittWare for extended warranty and support options