Directly Attached Accelerator & NVMe-over-Fabric

Reliable transport of NVMe frames with low latency and high throughput

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The 250-SoC enables the creation of remote, disaggregated storage or Ethernet Just-a-Bunch-of-Flash (EJBOF) to dramatically reduce the storage cost, footprint and power within data centers. The 250-SoC features a Xilinx Zynq UltraScale+ MPSoC device featuring both programmable logic and 64-bit ARM processors. This powerful, feature-rich device coordinates data transfer between two 100GbE network ports, on-board DDR4 memory and a PCIe Gen 3 host interface.

Key Features

2x 100GbE via 2 QSFP28

Ideal for NVMe storage arrays

ZU19EG MPSoC: 64-bit Cortex A53 ARM Zynq UltraScale+

Block Diagram, Data Sheet and Specifications

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  • Xilinx Zynq UltraScale+
    • ZU19EG FFVD1760 package
    • Core speed grade -2
    • Application ARM: Quad-core Cortex-A53 MPCore 1.5GHz
    • Real-Time ARM: Dual-core Cortex-R5 MPCore 600MHz
    • Graphics Processor: Mali-400 MP2
  • Contact BittWare for other MPSoC options

On-board DDR4 SDRAM

  • DDR4 SDRAM FPGA Fabric Memory
    • One 4GB bank of DDR4 SDRAM x72 bits
    • Transfer Rate: 2400 MT/s
  • DDR4 SDRAM MPSoC Memory
    • One 4GB bank of DDR4 SDRAM x72 bits
    • Transfer rate: 2400 MT/s

Host interface

  • x16 mechanical PCIe Gen3 capable
  • Configurable as x16 up to Gen3, or two x8 PCI in bifurcated slots

QSFP cages

  • 2 front panel 4-25Gbps-lane QSFP28 cages
  • User programmable low jitter clocking supporting 10/25/40/100GbE
  • Each QSFP28 can be independently clocked


  • 1 back panel 8-25Gbps-lane OCuLink connector
  • 1 back panel 8-16Gbps-lane OCuLink connector
  • Flexible configuration: NVMe, PCIe, 10/40/100GbE, OpenCAPI
  • 2 additional optional 8-lane OCuLink connectors (25 & 16Gbps)

Board control (front panel)

  • RJ45 1GbE access to the ARM processor
  • USB connector for UART to ARM processor

Datacenter Deployment, Health Monitoring & Reporting

  • On-board power, voltage and temperature monitoring
  • Field flash update via software
  • SMBus controlled anti-bricking, fallback and multiboot
  • SMBus access to unique board data and temperature sensor


  • Active and passive heatsink options


  • On-card power derived from PCIe slot supplies
  • Power dissipation is application dependent
  • Typical FPGA power consumption ~50W


  • Operating temperature: 5°C to 35°C


  • Manufactured to IPC JSTD-001 -Class 2
  • RoHS compliant

Form factor

  • Half-height, half-length PCIe board
  • Full-height PCI bracket option

Development Tools

FPGA development

  • BIST - Built-In Self-Test for CentOS 7 provided with source code (pinout, gateware, PCIe driver and host test application)

Application development

  • Xilinx Tools - Vivado Design Suite HLx Editions: HDL and C/C++ with HLS


  • 250-SoC FPGA board
  • Built-In Self-Test (BIST)
  • 1-year access to online Developer Site
  • 1-year hardware warranty

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