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Key Features

  • NIC Form Factor – Low Profile, Half Length PCIe form factor
  • PCIe Gen 3 or Gen 4 8-lane
  • Xilinx XCKU15P-2FFVA1156I FPGA -2 speed grade
  • 4GByte 2400MTPS x80 DDR4 memory (5x 8Gbit DDR4x16 discrete chips)
  • (4) M.2 connectors
  • (4) M.2 to OCULink 678mm cables
  • Available pre-configured with NVMe-oF accelerated functions: PCIe Gen 4 Host Bus Adaptor (HBA)
  • FPGA Configuration Functions (JTAG, Remote Flash Update, Reconfiguration, Fallback Mechanism, etc.)
  • Board Health Monitoring (Temperatures, Power, Voltages, etc.)
  • Unique Board Data in PROM
  • On-Board Anti-Bricking for Deployment in Data Center
  • Cabling options for OCuLink and MiniSAS-HD backplanes
  • OpenPOWER CAPI SNAP 2.0 for POWER9

This PCIe Gen 4-capable accelerator card can be added to PCIe or CAPI-enabled server platforms introducing an energy-efficient acceleration capability for applications including:

  • Database Acceleration
  • In-line Compression/Encryption
  • Checkpoint Restarting
  • Burst Buffer Caching

Board Specifications

Form Factor

  • Half-Height, Half-Length PCI Express card
  • Dimensions: 167.7 mm x 68.9 mm
  • Single or Double-Width options
  • Full-Height PCI bracket options

Host Interface

  • 8-lane PCI-Express Gen 4
  • Actual performance is host computer chipset and operating system dependent

Processing

  • Xilinx Kintex Ultrascale+ FFVA1156 package
  • Default configuration: KU15P
  • Core speed grade -2
  • Contact BittWare for other FPGA options

DDR4 SDRAM Memory

  • One bank of DDR4 SDRAM x 80 bits
  • 4GB per bank (8GB version also available)
  • Transfer Rate: 2400 MT/s

Application Development

  • Vivado Design Suite HLx Editions: HDL and C/C++ with HLS
  • OpenPOWER CAPI SNAP 2.0 for POWER9

Electrical

  • On-card power derived from PCIe slot supplies
  • Power dissipation is application dependent
  • Typical FPGA power consumption 25~50W
  • Card designed to deliver up to 75W power consumption

Quality

  • Manufactured to ISO9001:2008 IPC JSTD-001 -Class III
  • RoHS compliant

Power Supply Monitoring & Reporting

  • Voltage monitoring
  • Temperature monitoring
  • Fault condition reporting to FPGA Storage Options
  • Four on-board 960GB NVMe SSD sticks
  • Four on-board 1.92TB NVMe SSD sticks
  • Four OCuLink cables
  • Four MiniSAS-HD cables

Cooling

  • Single-width passive heatsink for FPGA power up to 25W
  • Double-width passive heatsink for FPGA power up to 50W

Environmental

  • Cooling: Air convection
  • Operating temperature: 5°C to 35°C

Deliverables

  • 250S+ FPGA card
  • Built-In-Self-Test (BIST)
  • 1 year access to online support lounge
  • 1 year hardware warranty

Customization

Technical specifications (e.g. FPGA type, size, exter- nal memory capacity etc.) can be modified to meet the exact needs of commercial customer applications as off-the-shelf product available to the general market.