Ruggedization Capabilities for FPGA and DSP Embedded Signal Processing Solutions from BittWare

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Design Philosophy

Ruggedization Capabilities

Mission critical applications require that certain product design considerations - thermal, vibration, and temperature - are a priority from inception, not after-the-fact. BittWare prides itself on its expertise and ability to architect and design extended temperature/ruggedized products for military/defense applications. In no instance is a commercial product simply modified for implementation in a rugged application.

The ruggedization levels provided in the chart below show maximum values and should be used as guidelines.

Characteristics	Commercial	Level 1U	Level 1C	Level 2C	Level 3C
Type	Air cooled	Air cooled	Air cooled	Conduction Cooled	Conduction cooled
Temperature
Operating	0°C to 50°C w/ 300 lin.ft/min airflow	0°C to 65°C w/ 300 lin.ft/min airflow	-40°C to 65°C w/ 300 lin.ft/min airflow	-40°C to 75 °C	-40°C to 85°C
Storage	-45°C to 100°C	-55°C to 100°C	-55°C to 100°C	-55°C to 125°C	-55°C to 125°C
Mechanical
Vibration	Random; 0.01g2/hz 15Hz to 2kHz (per MIL-STD-810E)	Random; 0.04g2/hz 15Hz to 2kHz (per MIL-STD-810E)	Random; 0.04g2/hz 15Hz to 2kHz (per MIL-STD-810E)	Random; 0.1g2/hz 15Hz to 2kHz (per MIL-STD-810E)	Random; 0.1g2/hz 15Hz to 2kHz (per MIL-STD-810E)
Shock	20g peak sawtooth 11ms duration	20g peak sawtooth 11ms duration	20g peak sawtooth 11ms duration	30g peak sawtooth 11ms duration	30g peak sawtooth 11ms duration

Conformal Coating	No	No	Yes	Yes	Yes
Humidity	0 to 95% non-condensing	0 to 95% non-condensing	0 to 100% condensing	0 to 100% condensing	0 to 100% condensing