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Design Philosophy
Ruggedization Capabilities
GT-3U-cPCI Board (GT3U)
The chart below provides ruggedization levels for the GT-3U-cPCI board. The ruggedization levels provided in the chart show maximum values and should be used as guidelines.
* Contact BittWare for availability.
| Characteristics |
Commercial |
Level 2C |
Level 3C* |
| Type |
Air cooled |
Conduction Cooled |
Conduction cooled |
| Temperature |
|
|
|
| Operating |
0°C to 50°C
w/ 300 lin.ft/min airflow |
-40°C to 75 °C
at thermal interface
|
-40°C to 85°C
at thermal interface
(w/o memory; limited FPGA power) |
| Storage |
-45°C to 100°C |
-55°C to 125°C |
-55°C to 125°C |
| Mechanical |
|
|
|
| Vibration |
Random; 0.01g2/hz
15Hz to 2kHz |
Random; 0.1g2/hz
15Hz to 2kHz (per MIL-STD-810E) |
Random; 0.1g2/hz
15Hz to 2kHz (per MIL-STD-810E) |
| Shock |
20g peak sawtooth
11ms duration |
30g peak sawtooth
11ms duration |
30g peak sawtooth
11ms duration |
| |
|
|
|
| Conformal Coating |
No |
Yes |
Yes |
| Humidity |
0 to 95%
non-condensing |
0 to 100%
condensing |
0 to 100%
condensing |
Additional board-specific ruggedization information can be found at the following links:
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Lifecycle & Quality Management
Global Partners
 
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